Laser IC Unpacking Device PL101
Laser IC Unpacking Device PL101
Laser IC decapsulation device that can remove the plastic part of plastic-molded ICs down to less than 100 microns from the surface of the IC chip, without damaging the chip. 【Features】 ○ As a pre-treatment for decapsulation using chemical solutions, it minimizes the impact of the chemical solution on ICs with Cu wiring, etc. ○ Decapsulation can be performed simply by dropping the chemical solution onto the surface of the chip; it is also possible to use a decapsulation device, and the amount of chemical solution used is extremely minimal. ○ Effective in reducing decapsulation time as a pre-treatment for dry decapsulation. ○ Removal processing in a short time; the processing time for an area of 10mm x 10mm is about 2 minutes. ○ The processing range can be set from a computer screen, and it is easy to operate by simply turning on the switch. ○ Compact design that can be installed on a desk. ● For other functions and details, please download the catalog.
- Company：日本サイエンティフィック
- Price：Other
